1 | Electrical & electronic products(Hazardous substance) | 1 | polybrominated biphenyls （PBBs） | Electrotechnical products – Determination of levels of six regulated substances(lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls,polybrominated diphenyl ethers) IEC 62321：2008 | Accredited Only for appendix A and GC-MS |
1 | Electrical & electronic products(Hazardous substance) | 2 | polybrominated diphenyl ethers （PBDEs） | Electrotechnical products – Determination of levels of six regulated substances(lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls,polybrominated diphenyl ethers) IEC 62321：2008 | Accredited Only for appendix A and GC-MS |
3 | Lead（Pb） | Accredited Only for ICP-OES |
4 | Cadmium（Cd） |
5 | Mercury (Hg) |
6 | Hexavalent chromium[Cr(Ⅵ)] | Accredited Only for appendix B and C |
2 | Electrical & electronic products(Halogens) | 1 | Fluorine (F) | Characterization of Waste – Halogen and Sulfur Content – Oxygen Combustion in Closed Systems and Determination Methods BS EN 14582:2007 | Accredited only for Oxygen Combustion and IC Method |
2 | Chlorine (Cl) |
3 | Bromine (Br) |
4 | Iodine (I) |
3 | Electrical & electronic products（Phthalates） | 1 | DIBP | Standard Operating Procedure for Determination of phthalates CPSC-CH-C1001-09.3 | Accredited only for ultrasonic extraction |
2 | DBP |
3 | BBP |
4 | DEHP |
5 | DNOP |
6 | DINP |
7 | DIDP |
4 | Electrical & electronic products（Others） | 1 | HBCDD | Electrotechnical products -Determination of HBCDD by gas chromatography - mass spectrometry GB/T 29785-2013 | |
5 | Solder | 1 | Viscosity | Solder Paste Viscosity-Spiral Pump Method IPC-TM-650 2.4.34.3: 1995 | Accredited Only for Solder Paste Viscosity-Spiral Pump Method |
5 | Solder | 2 | Metal content（Tin,Sliver,Copper） | Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed and Solders for Electronic Soldering Applications IPC J-STD-006C: 2013 | Accredited only for Spark Spectrometry |
3 | Powder Size & shape distribution | Solder paste JIS Z 3284-1994 | Accredited only for Annex1 |
4 | Flux content | Percentage of Flux on/in Flux-coated and/or Flux-cored Solder IPC-TM-650 2.3.34.1:1995 | |
6 | Electrical & electronic products(Failure analysis) | 1 | Micro-sectioning | Microsectioning, Maunual Method IPC-TM-650 2.1.1 E: 2004 | |
2 | dye penetration | Pinhole Evaluation, Dye Penetration Method IPC-TM-650 2.1.2 A: 1976 | Accredited only for BGA |
6 | Electrical & electronic products(Failure analysis) | 3 | Internal Visual Inspection | Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components IPC J-STD-035: 1999 | |
7 | Electrical & electronic products(Reliability test) | 1 | Vibration, broadband random | Environmental testing for electric and electronic products-Part2: Test methods-Test Fh: Vibration, broad-band random(digital control) and guidance GB/T2423.56-2006 | Accredited only for Frequency: 2-2000Hz; Displacement: 25mm, Acceleration:50g Thrust: 600kgf, Z-axis Weight : 29kg |
2 | Sinusoidal Vibration | Environmental testing for electric and electronic products-Part2:Test methods Test Fc: Vibration(sinusoidal) GB/T 2423.10-2008 |
7 | Electrical & electronic products(Reliability test) | 3 | Shock | Environmental testing for electric and electronic products Part2:Test methods Test Ea and guidance: Shock GB/T 2423.5-1995 | Accredited only for Shock Wave: half sine, Acceleration:2-30g, Pulse Width: 6~12ms |
4 | Thermal Shock | Environmental testing for electric and electronic products- Part 2: Test methods Test N: Change of temperature GB/T 2423.22-2012 | Accredited only for Test Nb: Change of temperature, and temperature scope: -40℃~125℃ |
